Used PETER WOLTERS AL2 #155749 for sale
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ID: 155749
Vintage: 1968
Double faced Lappers
Plate ext. diameter : 840 [mm]
Plate int. diameter : 210 [mm]
Number of satellites : 4
Satellites diameter : 340 [mm]
Diamond honing
Part maxi height : 20 [mm]
Honing : 1 or 2 faces
Rotation speed lower plate : 31-62 [rpm]
Rotation speed upper plate : 33-66 [rpm]
Shaft between parts rotation speed : 17/28/45/70/113 [rpm]
Motor power : 10 [kW]
Upper plate pressure : 0to 0.125 [kg/mm2]
Central system for driving satellite (gear) has been removed
Satellites do not rotate on themselves
Units were upgraded in 2006
1968 vintage.
PETER WOLTERS AL2 is a wafer grinding, lapping and polishing equipment for achieving very high performance on a variety of materials. This multi-purpose system features two separate grinding heads, a c-axis head for lapping and a flat head for polishing operations. The unit is designed to handle mini-wafer sizes up to 300mm and is ideal for applications such as ceramic, silicon and glass substrates. The machine is equipped with a closed-loop servo control, ensuring repeatable and precise operation. A full PLC control allows for automated implementation of a wide variety of wafer grinding, lapping and polishing processes. An integrated 2D vision tool allows in-process measurement of wafer diameter and ensures that grinding, lapping and polishing processes are consistently performed within tight tolerances. The asset is capable of running up to 3 simultaneous grinding or polishing processes, and can be configured with a choice of 3 lapping speeds. This model also features a built-in air cooling equipment which assists in the process and helps to maintain the temperature at optimal levels throughout the process cycle. The system utilizes high-precision diamond tools for consistent and high-performance results. It can use diamond slurries for lapping and diamond polishing pads for polishing and can achieve surface roughness as low as Ra 0.1µm. The unit features adjustable grinding depth parameters and has top-in and bottom-out grinding modes for achieving a variety of wafer thicknesses. The machine has an automated part handling tool to ensure repeatable alignment and transfer of wafers to subsequent processing stages. It is also equipped with a safety interlock asset to ensure the safety of the user. This model is engineered with a tool-free set-up that allows grinder modules to be exchanged easily and quickly. In conclusion, PETER WOLTERS AL 2 is a highly advanced and sophisticated, multi-functional wafer grinding, lapping and polishing equipment. This system offers precision, accuracy and repeatability, making it ideal for applications in industries requiring high levels of performance in the production of electronics and micro-electronic components.
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