Used PETER WOLTERS AL2 #293767660 for sale

ID: 293767660
Wafer Size: 2"-5"
Vintage: 1986
Double sided lapping machine, 2"-5" Wafer thickness: 780 µm Static frequency converter and hydraulics Cooling circuit 1986 vintage.
PETER WOLTERS AL2 is an automated grinding and polishing equipment, designed for use in the semiconductor and optics industries. The system provides durable and accurate 2-axis programmable grinding, lapping and polishing on even the most complex surfaces. It is equipped with a state-of-the-art CNC (Computer Numerical Control) control unit, allowing for precise and automated grinding, lapping and polishing operations. The machine is delivered as a component-ready package for fast and easy assembly. It includes all the necessary components, such as a grinding spindle, lapping plate, motor, grinding wheel, lap plate clamps, wafer clamping tool, dust extraction, and a pump and filtration unit. The asset is also designed with ergonometric features, such as an adjustable work height and ladder-style access to the grinding and lapping area. The linear motion model of the grinding/lapping/polishing machine features extremely low backlash and a high load carrying capacity, allowing smooth and precise machining. The equipment also features a low thermal mass design, which ensures low temperature drift and reduced cycle times. The grinding wheel is driven by two independently controlled main motors, each capable of speeds up to 2400 RPM. The grinding wheel displacement is electronically controlled, with a maximum displacement of +/-100 mm. The clamping system of PETER WOLTERS AL 2 is highly automated and easy to use. A single clamping unit can hold up to 12 wafers at a time, and provide a reproducible, repeatable clamping force every time. The machine features a self-diagnosis and safety tool, ensuring accuracy and safety. It also features a built-in automatic balancing asset, to protect the wafers from any kind of irregular shift. AL2 model is a highly versatile, reliable, and user friendly grinding, lapping, and polishing equipment. It is suitable for polishing a wide range of material types, from fresh wafers to used parts, and can be used for both thin and thick wafers. The CNC control systems are capable of controlling multiple workstations and a variety of process steps, offering the user maximum versatility. It is an ideal choice for any automated polishing process.
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