Used PETER WOLTERS AL2 #293798803 for sale

PETER WOLTERS AL2 is a wafer grinding, lapping & polishing equipment ideal for use in advanced semiconductor manufacturing. The system is highly versatile allowing its users to achieve desired surface perfection in a wide range of applications, from general wafer grinding and Surface Finishing to highly accurate lapping and polishing operations. PETER WOLTERS AL 2 offers a flexible, comprehensive, high precision solution from a single point of origin. This is achieved through its flexibility, the combination of process optimization, high speed processing and its modular approach. AL2's flexibility is manifested through the following features: High speed, accuracy, and rigidity with its Servo-Driven Linear Motor Total process control with the "Estracon" Advanced Control Unit Different mounting and feedback systems (rocker arm and traverse) High precision spindle and dynamic balancing machine Modular design that makes it easy to extend and change processes without needing significant retrofitting Dust collection tool Tool life management and automated tool change-overs Wide range of consumable polishing pads and tooling Remote monitoring asset for real-time analysis reporting Precision cleaning for on-site calibration Single and double side pass thru capabilities AL 2 offers process optimization by means of automated functions and adjustable parameters, allowing users to efficiently achieve their desired surface finish with the highest precision and accuracy. Its advanced control model allows for both constant and adjustable feed rates as well as up to 10 different polishing programs. PETER WOLTERS AL2 also boasts a high speed process allowing users to achieve their desired finish much faster than other manual lapping and polishing systems. Its integrated spindle equipment, with dynamic balancing and precision control, ensures high speed performance which helps improve production times. PETER WOLTERS AL 2's modular design means users can easily customize the system to their individual needs and create the perfect solution for all their wafer grinding, lapping and polishing needs. It's also easy to extend and add new processes, as well as undertake on-site maintenance and calibration. Finally, AL2's remote monitoring unit ensures users receive real-time analysis reports covering task, time, and ergonomics which help maximize productivity. Overall, AL 2 wafer grinding, lapping and polishing machine is an ideal solution for those looking for precision control, high speed performance, and flexibility for use in a wide range of applications.