Used PETER WOLTERS AL2 #9281056 for sale

ID: 9281056
Double sided lapping machine MILLITRON DE Marh meter Pin count on inner pin ring: 66 Pin count on outer pin ring: 186 Does not include refrigerant tank.
PETER WOLTERS AL2 is a "wafer grinding, lapping & polishing" equipment, ideal for use in semiconductor and MEMS fabrication processes. The system is designed to achieve superior results with a high degree of accuracy with minimal material removal. It uses advanced grinding, lapping and polishing processes to achieve flat, contoured, and even surface finishes over a wide range of wafer sizes. PETER WOLTERS AL 2 unit features an automated vacuum machine that holds the wafers in place while the grinding and lapping takes place. A range of wafer sizes can be accommodated with AL2 tool, from 200mm up to 300mm in diameter. The asset uses a unique combination of power grinding and diamond abrasives that is designed to achieve higher levels of accuracy than other systems. In order to ensure accuracy, AL 2 employs "Process Monitoring" which takes into account the condition of the wafer and adjusts grinding parameters as needed. The model also uses an array of sensors to continuously monitor the force, velocity, and temperature of the grinding, lapping and polishing process. This ensures that even under varying conditions, the results remain consistent and accurate. PETER WOLTERS AL2 equipment includes a host of features that enable it to produce superior results with minimal material removal. These features include an integrated dust extraction system, a load-balance monitoring unit, and a particle sizing machine. The dust extraction tool helps to keep the asset clean and prevents potential contamination, while the load-balance monitoring helps to optimize the grinding process. Finally, the particle sizing model helps to ensure that the particles of abrasive are of an ideal size for efficient removal. PETER WOLTERS AL 2 "wafer grinding, lapping & polishing" equipment provides the highest level of accuracy and surface finish for a wide range of wafer sizes. The system incorporates a range of advanced features designed to ensure consistent and precise results, with minimal material removal. From 200mm up to 300mm, AL2 unit is an ideal solution for semiconductor and MEMS fabrication processes, where precision and accuracy are essential.
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