Used PETER WOLTERS AL2 #9398316 for sale

ID: 9398316
Double disk lapping machine Manual Wheel width, 35" Wheel diameter, 35" Table: Length, 35" Width, 35" Spindle power: 14 kW.
PETER WOLTERS AL2 is a complete wafer grinding, lapping, and polishing equipment. It is designed for the pre-grinding, lapping, and polishing of semiconductor crystals, gallium arsenide and silicon wafers up to 300 mm in diameter. The system is equipped with an automatic crystal loading/unloading station and up to two wafer grinding heads. AR-ONE Advanced Robot Control is available as an option. PETER WOLTERS AL 2's wafer grinding heads are equipped with a machine-controlled grinding pressure sensor, allowing for a consistent high-precision grinding performance. The grinding heads come standard with a corrosion-resistant diamond disk, providing for quick and easy dressing for long periods of operation. The lapping station is designed for the single-sided holding of the wafer, with the entire process taking place in a sealed environment. This guarantees repeatability and minimizes cross-contamination. The lapping station features a variable rotation speed, allowing operators to adjust the process depending on the wafer's surface topography. The polishing station of AL2 features a patented Pneumix pressure film delivery unit, which ensures that the correct amount of lubricating paste is delivered to the film cartouche. This machine is designed to provide the most consistent grinding and polishing performance possible. Additionally, the tool utilizes high speed and consistent acceleration to minimize flatness errors and line-width variation in the polished wafer surface. AL 2 also features a patented CNC/manual adjustment mechanism, which allows for fine tuning of the wafer grinding, lapping, and polishing process. In short, PETER WOLTERS AL2 is a state-of-the-art wafer grinding, lapping, and polishing asset. Its patented technologies and advanced robot control model ensure high-precision and repeatable results. The equipment is perfect for all types of semiconductor, gallium arsenide, and silicon wafers up to 300 mm in diameter.
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