Used PETER WOLTERS FL 12P #131880 for sale

ID: 131880
Wafer Size: 8"
Vintage: 1988
Polishers For silicon wafers, up to 8" Wheel diameter: 1300 mm (4) Plates, 480 mm diameter Capacity: (60) 4" Wafers/hour, 100 mm/hour Power: 220/380 V, 50 Hz, 80 A 1988 vintage.
PETER WOLTERS FL 12P is a state-of-the-art wafer grinding, lapping, and polishing equipment. The system is designed for a full range of applications from semiautomatic grinding, lapping, and polishing to fully automated production of wafers of different substrates (silicon, gallium arsenide or other III-V compounds, quartz or glass). PETER WOLTERS FL 12 P is equipped with two precision-guided grinding and polishing heads; each with a working stroke of 450mm. This allows for full height and coverage of the wafer over the course of processing. The unique design also ensures optimal contact of the working surface (the wafer) with the grinding head. Furthermore, the grinding head has a hi-torque, drive motor; ensuring stability and accuracy required for precise, repeatable results. FL 12P has an integral, air-cooled, metal-halide light source, allowing the precise monitoring and control of the grinding/polishing process on the wafer. This ensures a uniform result and prevents over-processing. An advanced unit of temperature control also ensures precise temperatures for optimal production rates. The machine is a fully automated wafer processing machine. This allows for precise, repeatable results and ensures that a high degree of quality is consistent throughout the entire production process. The tool also allows for a high level of customization when setting up for various wafer sizes, shapes and substrate materials. Additionally, FL 12 P asset is complete with dust collection, automated loading and unloading, as well as full control over air pressure, pump speed and temperature. The support software includes an easy-to-use user interface, as well as a data logging and diagnostic model, ensuring optimal process control. PETER WOLTERS FL 12P equipment is the ideal choice for efficient, top-quality wafer grinding, lapping and polishing. Its advanced features guarantee precise, repeatable results, and its highly automated system allows for lower total cost of ownership and more efficient production.
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