Used PETER WOLTERS FL 12P #293827710 for sale

PETER WOLTERS FL 12P
ID: 293827710
Systems.
PETER WOLTERS FL 12P wafer grinding, lapping and polishing equipment is a comprehensive surface-processing solution. It offers single-sided or double-sided processing for precision grinding, face lapping and polishing of a wide range of wafer materials. It is designed for both covalently bonded and non-covalently bonded surface films. The system features an easy-to-use control panel and touch-screen input, enabling fast and accurate grinding, lapping and polishing. PETER WOLTERS FL 12 P also features a fully automated, single-chamber machine for wafer lapping and polishing. It is equipped with a diamond cutting tool, a Polivator pressure roller and a grinding unit. FL 12P offers high-precision, stable and reliable operation in a wide range of applications and processes. It operates at line speeds up to 600mm/second, allowing for maximum efficiency and productivity. The unit can process wafers with a size ranging from 200mm to1150mm in diameter. It also allows for optimal stock removal and tightly controlled and repeatable results. FL 12 P is also equipped with a range of functional, quick-changeable tools enabling enhanced process flexibility. It also offers monitored, programmable coolant sources, along with options to monitor both process parameters and product temperatures, allowing for efficient and predictable process results. The machine is also compatible with multiple standard grinder-polisher accessory items, such as load arms and polishing kits, so it can be tailored to fit different requirements and needs. PETER WOLTERS FL 12P is designed for consistent and safe operation, ensuring product integrity even in complex wafer grinding and lapping conditions. The tool offers durable components and full batch traceability, allowing the user to easily control the process. It also conveniently interfaces with external devices and software, facilitating information sharing. Overall, PETER WOLTERS FL 12 P is a versatile and efficient asset for wafer grinding, lapping and polishing. It provides a range of features and advantages, such as fast and accurate operation, compatibility with multiple standard grinder-polisher accessory items, strong components and full batch traceability, along with extensive process flexibility.
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