Used PETER WOLTERS FL 12P #9240688 for sale

PETER WOLTERS FL 12P is a wafer grinding, lapping and polishing equipment that offers high flexibility and precision for many grinding and polishing applications. It is designed for precision and efficiency, with integrated 3-axis motion control, a 300 mm grinding and lapping wheel, and an advanced PLC system. This unit functions by providing a modular approach to grinding, lapping, and polishing wafers for many different applications. Firstly, the machine is comprised of a robust base frame that provides vibration dampening and rigidity. The base frame houses a 3-axis motion control tool, enabling precise motion for the grinding process. The motion asset is driven by a powerful servo and stepper motor combination. It is capable of high-precision, low-vibration grinding, which is essential for the delicate nature of wafer grinding. Control of the grinder and lapping wheel is via a state-of-the-art PLC model. This equipment provides an intuitive, user-friendly interface in order to manage the grinding process with ease. The grinding and lapping wheel is housed within the base frame. The 300 mm diameter wheel is made of aluminum oxide, and is capable of both grinding and polishing wafers at high speeds. It has a spindle speed range of 100 to 1200 RPM, allowing optimal speed control thanks to the advanced control of the servo and stepper motor combination. The wheel is controlled by the user-friendly PLC system, which also makes it possible to make small adjustments to the process parameters such as pressure and speed. PETER WOLTERS FL 12 P also includes a wafer holder and a variety of additional accessories designed to optimize the grinding and lapping process. These accessories include wafer chucking mechanisms, additional grinding wheels, and other various tools and fixtures. The wafer holder itself is designed to hold multiple wafers, and is adjustable for different wafer sizes to ensure secure and accurate grinding. In conclusion, FL 12P is a state-of-the-art wafer grinding, lapping, and polishing unit. It is designed for precision and efficiency, with integrated 3-axis motion control, a 300 mm grinding and lapping wheel, and a user-friendly PLC machine. This tool is capable of grinding, lapping, and polishing multiple wafers at a time, and also comes with a host of additional accessories that are designed to enhance the grinding process. Thanks to this unique and advanced asset, users can confidently grind, lapping, and polish their wafers with little hassle and utmost precision.