Used PETER WOLTERS / LAPMASTER BD 300-L #9377579 for sale
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ID: 9377579
Double side polisher
With refrigerant tank and chiller
(2) Heads with (10) brushes for each independent parameters
Aspirofilter smoke filter
Room temperature: +15°C to +40°C
Humidity maximum (T=40°C): 50%
Humidity maximum (T=20°C): 90%
Minimum pressure: 6 Bar
Maximum pressure: 10 Bar
Average consumption: 3150 Per /min
Air quality: Filtered
Input: 3/8"
Aspiration:
Suction power: 1200 m³/h
Noise level: 75 dB(A)
Power supply: 3x400 VAC, 50 Hz, 25 kVA, 50 A, DC 230/240 V, 35 A.
PETER WOLTERS / LAPMASTER BD 300-L is a wafer grinding, lapping and polishing equipment designed for the production of ultraflat and high precision surfaces on wafers up to 300mm (12") in diameter. LAPMASTER BD 300-L is ideal for all phases of wafer production and can accommodate a wide range of applications, from single side grinding and lapping to back grinding. The unique metrology grade digital drive technology used in PETER WOLTERS BD 300-L allows for extremely precise control of the grinding speed. This allows for precise adjustments to ensure that the wafer surfaces are flat to a few angstroms - making this system ideal for demanding semiconductor applications. BD 300-L is also fitted with an automated cleaning unit to ensure consistent results, as well as a discharge machine to facilitate continuous operation. PETER WOLTERS / LAPMASTER BD 300-L has a variety of options to customize the tool for different applications. These include automated polishing heads, integrated wet or dry processing, tandem processes, multiple heads for simultaneous operations and tool change systems. The asset has a load capacity of 120 kg and can be used for a wide range of materials, including optical glasses, ceramics, metals, quartz and asphalt. LAPMASTER BD 300-L also features advanced safety features to ensure that operators and personnel are protected at all times. These include an auto-shutdown model to prevent overloading and an emergency stop equipment. PETER WOLTERS BD 300-L is also equipped with a highly reliable electrical system that ensures efficient and secure operation. Overall, BD 300-L is an ultra-precise wafer grinding, lapping and polishing unit perfect for high precision surface work on wafers up to 300mm (12"). It features advanced control technology and a range of options to customise the machine to different applications, as well as numerous safety features to protect personnel.
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