Used PETER WOLTERS / LAPMASTER BD 300 #9375038 for sale

PETER WOLTERS / LAPMASTER BD 300 is a specialized wafer grinding, lapping, and polishing equipment designed for transforming wafers from rough as-cut grinding to fine surface finishes with superior flatness and surface roughness. The system is designed to process up to 8-inch diameter wafers and is designed specifically to deliver repeatable and consistent results with minimal waiting time between individual wafer processing runs. The unit consists of the following components: surface grinding mechanism, spherical lapping and fine polishing, process controller, and support infrastructure. The surface grinding mechanism is a 12-inch diameter spindle-driven, ceramic-coated, true-flat platen. The platen is mounted on a linear-motor drive with a feed rate of up to 1.2 inches per second. This allows for extremely precise and repeatable surface grinding results. The spherical lapping and fine polishing component is made up of a 24-inch diameter Lapping and Finish Cooker. This component comes with six polishing heads and five lapping heads, each with dedicated grooves and speeds. This is used to achieve a dome and polish the surface of the wafer, providing a consistent degree of surface roughness with minimal distortion. The process controller controls the entire process and provides a platform for recording data and outputting results. LAPMASTER BD 300 offers an array of support infrastructure, including power input, air exhaust, and an air supply recirculation machine. It also offers a 25-liter coolant reservoir and multiple coolant nozzles. The tool is also equipped with two large, detachable, and collapsible tables, as well as a single-chamber environmental enclosure which offers protection from dust and other contaminants. This asset is ideal for applications in the semiconductor, optical, and data storage industries and is designed for effortless and efficient wafer grinding, lapping, and polishing. The integration of a process controller and cutting-edge technology and designed specifically for wafer processing ensures a higher level of accuracy and reproducibility. With its automated operations and durability, this model is a great choice for many wafer grinding, lapping, and polishing needs.