Used PETER WOLTERS / LAPMASTER MicroLine AC 1500-P3 #293645340 for sale

PETER WOLTERS / LAPMASTER MicroLine AC 1500-P3 wafer grinding, lapping & polishing equipment is a robust, high performance system designed to finish the most demanding optical and microelectronic components. It has been developed to shorten total finishing times while maintaining the highest precision accuracy over a longer period of use. LAPMASTER MicroLine AC 1500-P3 includes a control console with an easy-to-read graphical touch screen display, a controller module with integrated motion control and process sequence capabilities, a stainless steel cover and an integrated water cooling unit. The machine features a vertically mounted spindle which supports the grinding, lapping, and polishing tools over a range of speeds between 0 and 18,000 RPM. The grinding, lapping and polishing processes are all operated automatically via the centrally integrated control console. Dynamic, spindle-to-bridge and water cooling systems allow the user to program and control the material removal rate and grinding accuracy. The AC 1500-P3 also includes a unique tool spindle monitoring tool that provides real-time detection of tool abrasion and fatigue which assists the user with tool maintenance and enables the user to recognize needed process adjustments. The machine construction allows for automated material loading and removal. The drive unit is equipped with a total of 3 bridge axes, enabling 0.01 µm planar movement of the grinding, lapping and polishing tools, with variable feed and speed adjustment. Furthermore, the drive unit is mounted on a vibration-damping base to minimize any unwanted side-effects from the machining process. The AC 1500-P3 is designed to handle components with a maximum diameter of 150mm, maximum height of 20mm, and a maximum weight of 150kg. It is suitable for a broad range of different materials, including silicon, quartz, sapphire, graphite, & alumina ceramic. Overall, PETER WOLTERS MicroLine AC 1500-P3 is an industrial grade solution for precision grinding, lapping and polishing of the most demanding optical and microelectronic components. It is guaranteed to reduce the cost and improve the accuracy of any optical or microelectronic finished product.