Used PETER WOLTERS / LAPMASTER MicroLine AC 1500-P3 #293645342 for sale

PETER WOLTERS / LAPMASTER MicroLine AC 1500-P3 is a state-of-the-art wafer grinding, lapping and polishing equipment designed with the latest technology to provide precise and efficient grinding, lapping and polishing of wafers. This system is capable of single-sided and double-sided processing of wafers up to 8" in diameter, of various thicknesses, at speeds of up to 200 min-1. The AC 1500-P3 offers excellent performance, yet is extremely simple to use, thanks to its advanced motion control unit, user-friendly HMI, and advanced safety features. The advanced motion control machine employed by the AC 1500-P3 allows for precise and user-controlled multi-axis movements and connection of multiple power sources. This allows for important parameters such as grinding speed, automatic adjustment of stroke velocities, and precise abrasion control to be set precisely and accurately. Moreover, the tool is equipped with a closed loop pressure control, for the automatic reduction of surface pressure on the wafer, decreasing potential wafer defects. The user-friendly HMI employed by the AC 1500-P3 allows for easy set-up and control of the process, as well as storage of results. This allows for quick set-up and modification of grinding, lapping and polishing recipes depending on the material, thickness, and diameter of the wafer being processed. The asset is designed for maximum safety for the operator and environment. The advanced safety features employed by the AC 1500-P3 include an Anti-Sticking Model which prevents the workpiece from sticking. It also includes an Emergency Stop function, which automatically stops the process if an emergency occurs. In summary, LAPMASTER MicroLine AC 1500-P3 is an ideal wafer grinding, lapping and polishing equipment which offers the latest in advanced motion control, user-friendly HMI, and advanced safety features. This system is capable of precise and efficient grinding, lapping and polishing of wafers up to 8" in diameter, of various thicknesses, at speeds of up to 200 min-1. The unit is designed for maximum safety for the operator and environment, and is a machine of choice for quality wafer processing.