Used PETER WOLTERS / LAPMASTER MicroLine AC 1500-P3 #293645343 for sale

PETER WOLTERS / LAPMASTER MicroLine AC 1500-P3 wafer grinding, lapping & polishing equipment is designed to provide superior performance in a variety of production and research applications. This system features a high-precision, single-wheel spindle configuration with an integrated, high-speed, direct drive motor to ensure precise and consistent control over the grinding and lapping processes. The unit also supports different combinations of grinding stones and lap plates to meet the specific needs of each application. The main components of LAPMASTER MicroLine AC 1500-P3 wafer grinding, lapping & polishing machine include: an Automatic Clamping Table, a Control Panel, a Micro-Metric Grinding Head, a Fully-Controlled Turret Spindle, a Central Lift Station, a Recirculation Tool, a Lift Table, a PC-interface, and a Detailed Measurement Software. The Automatic Clamping Table ensures a leveled rotation of the wafers over the Micro-Metric Grinding Head to enable a precise and consistent grinding process. The Control Panel features a multisensory console to enable operation from the asset itself or from an externalUser Interface. The Micro-Metric Grinding Head offers customizable grinding stone and lap plate combinations for a wide range of materials and applications. The Fully-Controlled Turret Spindle is designed for optimal speed control with direct drive principles. The Central Lift Station is a tiltable motion platform for precise sample mounting and controlled lift services. The Recirculation Model is designed to safely re-circulate the wafer polishing slurry from the polishing head back to the slurry reservoir while protecting the Central Lift Station and the spindle from extensive damage and wear. The Lift Table can be used to precisely move the wafers around the equipment during the grinding, lapping, and polishing process. The PC-interface allows for data transfer between the system and a PC to display precision information and operation data. The detailed measurement software provides feedback on the wafer grinding, lapping, and polishing process. PETER WOLTERS MicroLine AC 1500-P3 wafer grinding, lapping & polishing unit provides superior performance and precision for a variety of applications by combining state-of-the-art control and measurement capabilities with a high-precision, direct drive spindle design.