Used PETER WOLTERS MicroLine AC 319 #9401242 for sale

ID: 9401242
Vintage: 1997
Double sided lapping machine 1997 vintage.
PETER WOLTERS MicroLine AC 319 is a state-of-the-art wafer grinding, lapping, and polishing equipment designed to deliver the finest surface results on a range of precision substrates. The machine has been specifically engineered for the grinding, lapping, and polishing of diverse materials such as metal, glass, ceramic, carbide and sintered materials. The system is based on a high-speed precision digital drive that allows for precise and reliable performance of grinding, lapping, and polishing on wafers up to 200 mm in diameter. The unit utilizes a modular concept that enables the integration of additional automation components such as computer-controlled loading and unloading of substrates to the working stations. It is also equipped with an automated diamond wheel dressing station that ensures an optimal wear of the grinding wheel. An intuitive and powerful software controls the entire grinding, lapping, and polishing process, allowing the operator to conveniently set up the parameters and monitor the machine. The grinding and lapping part of the tool has been designed to achieve a maximal removal rate of different hard materials such as single-crystal silicon, sapphire, aluminum and other brittle material thanks to its combination of a powerful lapping plate and a CNC-controlled grinding head. A special device supports the plate movement to prevent any possible damage to the assembly. The asset is also capable of a wide range of polishing processes on wafers with abrasive particles such as nanodiamonds, polycrystalline diamond and aluminum oxide. MicroLine AC 319 also includes several safety features to prevent any potential harm to the operator. It has proofing elements (e.g. shielded grinding wheel, etc.) to protect users from exposure to potentially hazardous particles. In addition, an alarm can be set up to remind the operator to wear appropriate protective equipment. In general, this model provides an ideal solution for high-quality wafer grinding, lapping, and polishing tasks for a wide range of production requirements.
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