Used PETER WOLTERS MicroLine AC 319 #9401243 for sale

PETER WOLTERS MicroLine AC 319 wafer grinding, lapping and polishing equipment is a precision surface-finishing solution designed to deliver consistent, high-quality results with fast cycle times. The system is suitable for processing a variety of materials from hard sunsoidal elements to soft delicate wafers. It can accommodate wafers up to 4 inches in diameter and provides exceptional flatness, roundness, and surface roughness with repeatable results. The unit consists of three independent modules: grinding, lapping, and polishing. The grinding module utilizes Machine 15 software to digitally regulate wafer grinding performance with precise speed and feed rates for optimal results. It is equipped with an air or water cooled grinding spindle which allows for precise control and fine tuning of the surface finish. In addition, the grinding wheel can be replaced in seconds and a range of different wheel chemistries are available to provide flexibility for different applications. The lapping module features a precision-engineered platen and a pneumatic loading arm. The platen consists of a high-precision AC motor and a position-controlled drive tool. This ensures that wafers are correctly lapped and optically polished resulting in precise and accurate surface finishes. If a harsher substrate is required, then an optional lapping wheel can be added to further enhance the process. The polishing module is designed to provide a uniform and high-quality polishing for a variety of materials. It utilizes a high torque DC motor that is capable of reaching speeds up to 10,000 RPM for precise polishing results. The polishing wheel is adjustable to provide either a hard or soft finishing, and a range of different polishing media can be used depending on the application. MicroLine AC 319 wafer grinding, lapping and polishing asset offers the flexibility to accommodate a variety of materials, fast cycle times, and superior finish quality. It is a perfect solution for critical applications in the semiconductor and other industries that require precision surface-finishing.