Used PETER WOLTERS MicroLine AC 319 #9401244 for sale

ID: 9401244
Vintage: 1998
Grinding machine 1998 vintage.
PETER WOLTERS MicroLine AC 319 wafer grinding, lapping and polishing equipment is a versatile, fully automated and modular processing equipment, designed for grinding, lapping and polishing of a variety of substrates, ranging from single sided to double sided wafers. This system incorporates a user friendly and comprehensive range of operational and programming software modules, allowing for significant reduction in the lead time and costs associated with installation and operation. The unit is equipped with a powerful 10HP DC motor, to drive the grinding and polishing processes at a speeds up to 600rpm. The forced air-cooling machine and automatic material handling systems are integrated, allowing for reliable and consistent results. Additionally, a unique and innovative double-sided interferometer ensures a tight process control and smooth grinding, lapping and polishing attributes. MicroLine AC 319 can accommodate wafers up to 4inch in size and features a pneumo-hydraulic tool and an optimal interface designed to ensure precise and repeatable results, while eliminating any mechanical degradation of the substrate. As part of the machine, a computer-controlled wafer loader is also available as an additional feature. For efficient grinding and polishing cycles, the machine features a robust and adjustable platen and suspension asset, designed to ensure that the substrate is held securely in place throughout the different processing stages. The pneumo-hydraulic model ensures that the cold mounting is securely and precisely held in place, and that the grinding pressure is accurately adjusted. In addition to its innovative technological features, the machine comes with an easy-to-use graphically based operating software and an intuitive user interface. Furthermore, it includes options for data logging, allowing for reliable process control and optimization. Overall, PETER WOLTERS MicroLine AC 319 wafer grinding, lapping and polishing equipment is a reliable and efficient equipment, combining innovative technologies and straightforward user interface, allowing for effective and accurate fabrication of complex substrates.
There are no reviews yet