Used PETER WOLTERS MicroLine AC 319 #9401247 for sale

PETER WOLTERS MicroLine AC 319 is an accurate and efficient equipment for grinding, lapping and polishing wafers. The system uses a special 9-axis correction alignment unit that enables the grinding and polishing of both flat and complex surfaces to consistently high levels of precision. It is designed to allow users to get maximum efficiency and reliability from their wafer processing. The primary component of MicroLine AC 319 is the air spindle chuck (ASC) which is precision engineered to ensure perfect alignment and accuracy when processing wafers. The ASC is driven by a powerful motor that features air bearings and electrodynamic suspension technology. This combination of features delivers the highest levels of performance at speeds of up to 20,000 rpm. Each wafer is supported on a constant-force kinematics stage which produces a constant force throughout the entire grinding and lapping process. This ensures a highly repeatable and constant quality across all wafers that are processed on the machine. PETER WOLTERS MicroLine AC 319 tool also includes a number of tools for monitoring and controlling the grinding and lapping process. These include dedicated hardware and software components such as a process monitoring module, grinding monitors and trend displays as well as in-process diagnostics and control logic. MicroLine AC 319 also features a range of software packages that have been designed to streamline grinding and polishing processes. This software has been designed to very high standards and provides users with an easy-to-use front-end interface that can be tailored to suit individual needs. These software packages also provide the user with detailed information about the status of the asset and its various parameters, as well as options for programming the model for specific processes. Overall, PETER WOLTERS MicroLine AC 319 equipment is an efficient and reliable tool for grinding, lapping and polishing wafers. Its powerful air spindle chuck, advanced control logic, and comprehensive software packages make it an ideal choice for anyone looking for a reliable and accurate system for wafer processing.