Used PETER WOLTERS MicroLine AC 700-F #293657985 for sale

PETER WOLTERS MicroLine AC 700-F is a computer-controlled, industrial-grade wafer grinding, lapping and polishing equipment. It is designed to work with a variety of materials, including silicon, quartz, sapphire, metals, and ceramics. The system can process wafers ranging from 2 to 400 mm in diameter and can handle a maximum wafer thickness of 200 microns. MicroLine AC 700-F is constructed using stainless steel components and has a compact, user-friendly design. The unit includes a grinding/lapping and polishing module, a precision indexing table, and a sizing station. The grinding and lapping module features a split head design that enables edge grinding with an optimal grinding wheel pitch. The indexing table provides accurate angular orientation for the grinding and lapping process and is equipped with a patented chain belt drive for a smooth running of the process. It can be coupled with an optional robotic handling machine for precise wafer positioning and process control. The sizing station is equipped with diamond cutting blades and can process wafers with a precision of less than 1 micron. The tool is controller by an advanced 4-axis CNC controller which allows for a precise control of the grinding, lapping and polishing processes. The asset is equipped with a PC-based graphical User Interface for simple operation and process optimization. The control model has a memory capacity of 5000 programs and can store up to 10 sets of different parameters. The equipment also has self-diagnostic and calibration functions which allow for efficient troubleshooting and process optimization. PETER WOLTERS MicroLine AC 700-F is a versatile, industrial-grade wafer grinding, lapping and polishing solution. It's robust construction and precise, automated control systems guarantees smooth operation and repeatable results. The system is ideal for processing a wide range of materials to tight manufacturing tolerances, making it suitable for a range of professional production applications.