Used PETER WOLTERS MicroLine AC 700-F #293815062 for sale
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ID: 293815062
Vintage: 2007
Double-sided batch processing machine
Used for Grinding of sapphire blanks
Chiller
Breakout station
Automatic powder filling station
Monitor
Keyboard
Mouse
Unloading trolley
Cooling system
Thickness: +- 10 microns
2007 vintage.
PETER WOLTERS MicroLine AC 700-F is a highly sophisticated wafer grinding, lapping and polishing equipment designed for the processing of a variety of semiconductor materials. The system is equipped with an advanced CNC control and automated configuration to ensure maximum precision and repeatable results. It is capable of producing the highest quality surfaces available on the market. The unit is composed of numerous components, including a CNC grinding table, a PLC regulating unit, a pneumatic spindle drive, and several grinding, lapping and polishing modules. The grinding table features an advanced CNC control machine which ensures great precision of the grinding process while the PLC regulating unit ensures proper operation of all the components. The pneumatic spindle drive facilitates dynamic motion and allows the use of a variety of different tools which can be changed quickly and precisely. The grinding process is conducted on a diamond grinding wheel. Several cutting parameters are adjustable and can be easily adjusted depending on the requirements of the individual process. The process results in flats, surface textures and shapes which can be tailored for specific applications. The lapping process enables greater surface accuracy, increased surface finish and removal of defects. Lapping is achieved by rotating the workpiece at high speeds while applying a pressure to the part. The tool is equipped with a vacuum source which removes excess swarf and prevents damage to the optical surface. The polishing process uses diamond abrasives to achieve a near net shape result with a surface finish of up to 4nm RMS. The polishing can be adjusted to produce the highest quality surface finish while maintaining the desired flatness and waveform. MicroLine AC 700-F is an invaluable tool for the production of the highest quality components. Its sophisticated CNC control, automated configuration, and lapping and polishing capabilities ensure great surface finishes and repeatability. This asset is ideal for producing superior and complex components with tight tolerances and is a must-have model for any wafer fabrication facility.
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