Used PHILTEC INSTRUMENTS 2015-F #9397410 for sale

PHILTEC INSTRUMENTS 2015-F is a high-precision wafer grinding, lapping, and polishing equipment that is designed to maximize precision and performance. The system can process several hundred wafers at a time, making it ideal for manufacturing operations in need of high-volume production. 2015-F unit utilizes innovative double-sided grinding and lapping technology, which allows for quick and efficient processing of the intricate micro-structures found in semiconductor wafers. This technology is capable of producing nanometer scale engineered structures with a single pass, ensuring consistent and accurate grinding and lapping results. The machine is highly customizable, allowing variations in grinding speeds, pressure, and diamond leveling polishing. PHILTEC INSTRUMENTS 2015-F is also equipped with a fully automated control tool that provides accurate and reliable control parameters. This advanced control asset allows for fast and precise wafer movement throughout the entire grinding and lapping process, while preventing any damage that may occur due to operator inexperience. 2015-F model includes an integrated high-speed, low-noise, high-resolution CCD camera. This camera provides real-time feedback about the grinding, lapping, and polishing process and a magnified view of the microstructure details. In addition, the equipment is integrated with a state-of-the-art 3D visual measuring system. This unit uses advanced optical imaging technology to provide detailed feedback on the wafer's profile and surface integrity before, during, and after the grinding process. PHILTEC INSTRUMENTS 2015-F machine is designed for process consistency, reliability, and accuracy. It offers reliable, repeatable, and cost-effective production needs for a variety of industries and applications. The tool's advanced automation and integrated 3D visual measuring capabilities make it perfect for semiconductor applications, as it can quickly and accurately process intricate microstructures.