Used PLUS TECH BS-102 #157466 for sale

PLUS TECH BS-102 Wafer Grinding, Lapping and Polishing Equipment is a versatile, high-performance system designed specifically for the precision engineering of semiconductor wafers. It uses a diamond grinding disk and is highly efficient in polishing and grinding applications, offering a range of material removal options. BS-102 is featuring a rigidly designed grinding disc to ensure precise grinds and lapping. It also feature a closed loop water-cooling unit to ensure that the wafer is not exposed to excessive thermal stress during the grinding or polishing process. This enables the machine to achieve high accuracy and repeatability in reducing normal surface irregularities. The tool comprises of three basic components; the grinding disc, the control panel, and the polishing sensors. The grinding disc is the centerpiece for the precision machine, providing a robust grinding surface that offers excellent cut performance with low surface interference. By utilizing high-precision bearings and motors, the grinding disc is able to rotate with minimal vibration, while the electronic polishing sensors accurately control the speed of grinding and lapping. The control panel allows the user to customize the parameters of the grinding process and monitor its progress. The panel is equipped with an LCD display and digital display that provides the user with a visual display of the current settings and grinding process. It also allows for adjustments to be made quickly and efficiently, allowing for optimal performance. Finally, the polishing sensors allow for a precise finish at the end of the grinding or lapping process. The sensors can detect the surface roughness of the cut and provide highly accurate machine feedback for the operator. This allows for consistent and repeatable results, ensuring that wafer grinding or lapping is done to the highest quality. With a combination of accurate grinding and polishing, PLUS TECH BS-102 Wafer Grinding, Lapping and Polishing Asset produces consistent results, delivering high quality wafers with minimal defects. With its robust and reliable design, this model is sure to meet the highest requirements of the semiconductor industry.