Used PLUS TECH SC-3050 #157462 for sale

PLUS TECH SC-3050 Wafer Grinding, Lapping & Polishing equipment is a state-of-the-art system designed to produce a wide variety of finished silicon or ceramic wafers. Using a precision-guided, computer-controlled process, this unit is engineered to help create a wafer surface with a high level of flatness and roughness accuracy. SC-3050 is capable of high-speed grinding, lapping, and polishing of large wafers up to 8.0 inches (20.32 cm). PLUS TECH SC-3050 is equipped with a precision grinding wheel and polished lap ring, two variable speed lapping plates, and a high-powered polishing pad. The grinding wheel is designed to give a precise diameter and thickness to each wafer as it is processed allowing for perfect repeatability. The polished lap ring on the grinding wheel helps to create a surface with a low surface roughness value. This offers superior grinding control when creating the desired finish on the wafer. The variable speed lapping plates are capable of producing both fine and coarse surfaces. This option provides maximum control of the lapping process and offers consistency in the texturing and smoothing of each wafer. The polishing pad on SC-3050 is a superior pad which is designed to produce a uniform, high-gloss finish on the wafer. PLUS TECH SC-3050 Wafer Grinding, Lapping & Polishing machine comes equipped with a user-friendly touch-screen interface with an intuitive menu tool which provides a step-by-step guide throughout each step of the process. The interface also provides access to SC-3050's detailed machine data points, which offers users full transparency on the entire process. Additionally, the asset is designed with a multi-station layout which allows for multiple wafers to be processed concurrently. PLUS TECH SC-3050 is one of the most advanced systems on the market, and provides unrivaled levels of precision and performance. With its innovative features and enhanced user experience, SC-3050 is the perfect choice for wafer grinding, lapping, and polishing.