Used PLUS TECH SC-3050 #293670423 for sale

PLUS TECH SC-3050 is a comprehensive solution for precision wafer grinding, lapping and polishing. It is a three stage equipment featuring a three-orbital grinding/polishing head, a spreader tool with polishing disc, and a roller tool for lapping. This advanced grinding/polishing system provides 120 mm (4.7in) of grinding/polishing capacity over the entire disk surface, enabling highly accurate, repeatable and fast wafer grinding, lapping and polishing processes. The three-orbital grinding/polishing head features three independent orbital motions, with maximum grinding depth of 0.3mm (0.01in) and up to 9µm (0.35mil) final polish. This unit allows for maximum wafer profile accuracy and repeatability. The machine is equipped with diamond grinding/polishing and lapping media providing maximum one-step grinding and lapping action for faster, higher quality results. SC-3050's spreader tool offers superior uniformity in both grinding and polishing processes. The spreader tool is equipped with a polishing disc and a variable pressure roller assembly which enables low-force polishing that minimizes break down of fragile material. The adjustable weight and speed capabilities allow for precise and repeatable polishing processes. The lapping tool is a double-wheel roller that is designed to offer optimum surface lapping quality with reduced material removal. It is also equipped with variable pressure rollers allowing low-force lapping and a slower turntable to minimize material destruction. PLUS TECH SC-3050 offers users a comprehensive tool for fast, precise, repeatable wafer grinding, lapping and polishing. It has been designed to meet and exceed global industry standards and is the perfect solution for precision industrial applications.