Used PLUS TECH SCU-4050 #157467 for sale

PLUS TECH SCU-4050 Wafer Grinding, Lapping & Polishing Equipment is an automated solution for grinding, lapping and polishing semiconductor wafers for applications such as MEMS, CMOS imaging, optical sensors, LED and power device packaging. The system features a two-axis, high-precision grinding/lapping head controlled by Servo-motion with motion resolution to 2nm, enabling extremely fine polishing to the tightest tolerances. The 4050 can automatically control the grinding process and polishing parameters including grinding speed and abrasive concentration, as set in advance by the user, through a graphical user interface. Other key features include active vibration isolation via an air damper unit, precise adjustment of the angle of ruler, microscope, and imaging machine, and real-time monitoring using a CCD camera with real-time wafer mapping. The integrated grinding and lapping procedure used with this tool produces higher precision results than a manual approach. The 4050 is also equipped with an in-line monitoring asset. This utilizes an Optical Fiber Monitoring kit combined with a CCD camera, lens and an image processor. The monitoring model allows for visualizing the lapping and grinding process, as well as detecting problems in real time. Additional features of SCU-4050 include automatic loading/unloading, automatic size measuring/temperature sensor, a calibration equipment, and various types of grinding/polishing media for different types of wafers. The system also features several safety features such as an air blow nozzle and an emergency stop button. PLUS TECH SCU-4050 is a complete wafer grinding, lapping, and polishing unit designed to produce high quality results in the most efficient manner possible. It combines high accuracy operation with a wide range of grinding and polishing settings, allowing users to achieve their desired results in a precise, consistent, and cost-effective way.