Used PLUS TECH STD-204L-NCP #157469 for sale

PLUS TECH STD-204L-NCP is a high-precision wafer grinding, lapping, and polishing equipment designed for the mass production of advanced microelectronic components and semiconductor foundries. This system produces very high-quality surfaces with near-perfect surface finish and high-accuracy repeatability. STD-204L-NCP features a unique design, unlike any other wafer grinding, lapping, and polishing unit available on the market. The main component of the machine is an ultra-precise, multi-axis spindle, allowing precise angular and radial movements. This allows for precise grinding and polishing of complex shapes with perfect form and finish. The grinding and polishing head is equipped with an advanced tool monitoring asset, and can be integrated with digital imaging and metrology systems for quality control purposes. Furthermore, the model is equipped with a high-speed, high-precision linear motion equipment featuring control technology, high load capacity and rigidly mounted motors for precise control of table movements, even on uneven surfaces. The system can work with, or without a vacuum bed, with or without coolants and lubricants, and with or without dust extraction systems. Also, this unit can be directly linked to a process control machine, allowing for full automation, accuracy, and reliability. Additionally, PLUS TECH STD-204L-NCP features a closed loop control tool, optimizing the processing time and providing data logging capabilities, process monitoring and adaptable parameters. This allows for efficient, uniform and consistent processing of the material in a wide range of applications, including wafer grinding, lapping, polishing, oxidation removal, cleaning, and more. In short, STD-204L-NCP is a versatile and reliable high-precision wafer grinding, lapping and polishing asset, providing a range of grinding options, process monitoring and consistent performance for the mass production of advanced microelectronic components. This model provides high-quality surfaces and high accuracy repeatability with perfect form and finish, enabling the production of effective, economical, and high-quality semiconductor foundries.