Used POLISHER SEMI CON 8 Spindle #9004436 for sale

POLISHER SEMI CON 8 Spindle is a professional wafer grinding, lapping & polishing equipment designed for use in the semiconductor industry. The system consists of eight independent, self-contained spindles configured in a circular housing. Each of the eight spindles have variable speed controls and a power output of 1/4HP each. The spindles can be independently adjusted for different grits and polishing speeds, allowing the user to produce precise requirements for their unit. The spindle base has a 75 mm in diameter which allows for each spindle to accommodate different wafer sizes from 50 to 300mm. The machine is designed for use with both diamond and abrasive lapping compounds, allowing the user to choose from a wide range of polishing materials for their particular need. 8 Spindle has a built-in safety feature with an interlock switch that automatically shuts off the power when the heads/lid is opened. This eliminates any risk of injury and accidental damage to the tool. The spindles are also designed to accommodate a wide range of grinding pads for wafer grinding and polishing needs. The asset also offers a wide range of finishes, with a maximum of Ra 0.1 microns. This highly precision finish offers extremely tight tolerances that are hard to achieve through manual polishing. POLISHER SEMI CON 8 Spindle also features several additional productivity boosting advantages, including a low noise level and a relatively small footprint. This reduces installation and operational costs, without sacrificing performance. 8 Spindle is an ideal tool for precision grinding and polishing operations in the semiconductor industry, providing highly precise and controlled results. Its variable speed controls, powerful motor, and wide range of grinding and polishing options make it the ideal choice for the needs of those in the industry.