Used PR HOFFMAN 32B-5 #9183340 for sale

PR HOFFMAN 32B-5 is a state-of-the-art wafer grinding, lapping and polishing equipment specifically designed for the fabrication of advanced microelectronic devices. It features a unique mandrel and truing mechanism which allows for quick and precise alignment of the wafer for optimal results. This system is capable of high-precision, quick cycle grinding, lapping and polishing of both curved and flat wafers from 1mm to 6 mm in diameter. 32B-5 has a fully-enclosed Sump Grinding Unit with a stainless steel grinding chamber, a ceramic polishing platen and standard conveyor drive unit. The grinding chamber is equipped with diamond grinding wheels, allowing for high precision lapping and grinding. The location and speed of the wheels are adjustable, allowing the user to achieve the ideal grinding speed and provide consistent results. The polishing platen provides a uniform, flat surface. The conveyor drive machine features an adjustable speed that allows the user to further control the speed of the tool, as well as the size of the wafers that can be processed. The asset is highly automated, allowing operators to simply select their desired grinding, lapping, and polishing settings, and have the machine carry out the operation. The intuitive user interface makes it easy for even novice users to navigate and get the most out of the model. It also has an emergency stop switch and a visual alert for any problems. PR HOFFMAN 32B-5 is capable of achieving extremely high precision in the grinding, lapping and polishing of advanced microelectronic devices such as VLSI (Very Large Scale Integration) and optoelectronics. The unique mandrel and truing mechanism ensure that the wafer is aligned with the highest accuracy, while the adjustable grinding and polishing speeds for maximum precision. This equipment is ideal for high-precision grinding, lapping and polishing of small to medium sized wafers in the fabrication of advanced microelectronic devices.