Used PR HOFFMAN 4800 #9227629 for sale

PR HOFFMAN 4800 is a high-performance, precision wafer grinding, lapping, and polishing equipment designed for the semiconductor and scientific research industries. This machine utilizes a precision-controlled grinding system to effectively lap and polish surfaces to exacting standards. It consists of three basic units: the control unit, the grinding unit, and the lapping unit. The Control Unit of the unit comes with an easy to use touchscreen interface, and offers a variety of advanced process parameter settings that allow the user to achieve the desired results. It also features a data logging and analysis software package which provides real-time feedback on process performance. The Grinding Unit is the heart of the machine. It uses a diamond-tipped grinding wheel to quickly and accurately lap surfaces into exact flatness. The Grinding Unit also features an automated loading tool and a high-precision load cell which ensures accurate results every time. The Lapping Unit is the workhorse of the asset. It consists of two precision-controlled vacuum chambers, each with a separate vacuum feed model, and each containing a dedicated lapping plate. This allows for two separate lapping processes to take place while controlling for temperature, pressure, and cycle time. The lapping plates are designed to evenly lap wafers to precise sizes and depths for the desired circuit or device type. 4800 is one of the most precise and capable machines available on the market today. With its high-precision grinding, lapping, and polishing equipment, the machine is able to achieve specific surface finish and flatness requirements with greater accuracy and repeatability than any other system available. This makes it the perfect choice for the semiconductor and scientific research industries where precision and process control are key.