Used PR HOFFMAN PR-1 50T #9195340 for sale

PR HOFFMAN PR-1 50T is a wafer grinding, lapping and polishing equipment designed to provide maximum performance and efficiency for precision machining of semiconductor wafers. This system is designed to produce flat, smooth surfaces, free of grain boundaries, particles, and defects. The PRHoffman PR-1 50T features a tilting table, allowing for precise control over the grinding and lapping process. It is equipped with a wide range of patents, as well as a state-of-the-art flatness sensor for the measurement of sintered surfaces. PR HOFFMAN PR-1 50T utilizes a closed-loop unit, which processes both ferrous and non-ferrous materials. This ensures a consistent and repeatable grinding and lapping process. The machine is capable of accommodating a variety of wafer sizes and thicknesses, ranging from 0.3 to 3.0mm. Additionally, the tool features a water-cooled spindle, allowing for precise temperature and pressure control during the grinding and lapping process. PR-1 50T also offers pre-programmed recipes for common processing tasks, eliminating the need for manual parameter entry. PR HOFFMAN PR-1 50T features a custom software package for optimizing grinding and lapping operations, giving users greater control over their process. It is also fully automated, allowing for remote operation and monitoring of the asset. This model also eliminates the need for manual cleaning, as an integrated liquid cleaning equipment enables rapid removal of polishing residue. PR-1 50T incorporates a number of safety features, such as a lock-out/tag-out system, emergency stops and an auto-calibration sequence. Additionally, it features an ergonomic design and a large viewing window, allowing users to observe the process. This unit is capable of producing superior quality results, with rapid turnaround times and excellent repeatability.