Used PR HOFFMAN PRIA-S 50T #9197380 for sale

PR HOFFMAN PRIA-S 50T is a high-precision wafer grinding, lapping and polishing equipment. This system is designed to meet the highest standards of accuracy and precision in the grinding, lapping and polishing of wafers with delicate electronic components. PRIA-S 50T unit is particularly suited for the challenging and complex needs of semiconductor processing. It is known for its speed, accuracy and robustness. PR HOFFMAN PRIA-S 50T is a fully automated machine designed to execute a wide variety of processing operations. It features a modern, modular design, which allows for customization and versatility. The tool contains a 'Grinder Controller' that is used to program the grinding process according to a given set of parameters. It also includes an 'Input Arm' that moves the wafer to the grinding wheel for precise control of the wafer position. The asset has an array of automated sensors that constantly monitor the wafer's position, ensuring flawless accuracy. It is also equipped with a cooling model to protect the wafer's delicate structures from heat damage. This equipment is designed to eliminate the human factor from the grinding process and ensure consistent results. PRIA-S 50T is capable of grinding, lapping and polishing wafers from as small as 5 microns in width to as large as 1000 microns in width. This system can be used to finish a variety of materials such as silicon, silicon oxide, gallium arsenide and gallium nitride. This unit is also capable of producing ultra-precise mirror holes with diameters as small as 2 microns. PR HOFFMAN PRIA-S 50T is a powerful machine that is designed to consistently deliver superior performance. With its advanced technology and modern design, this tool is perfect for the most challenging applications in semiconductor processing. It is a reliable, cost-effective, and user-friendly option for any laboratory or production environment.