Used PRECISIONLAP 900 #9251421 for sale

PRECISIONLAP 900 is a state-of-the-art wafer grinding, lapping, and polishing equipment specifically designed to accurately meet the challenging requirements of the microelectronics industry. Utilizing the latest available technologies, the system provides superior process control and repeatability. 900 features a dual spindle design, providing up to two grinding and polishing operations to be conducted simultaneously. Each spindle is capable of accommodating multiple grinding and polishing tools, allowing for a wide range of specialized tasks to be performed. The unit also features a programmable automatic indexing machine, allowing users to easily switch between different polishing and grinding procedures in a single run. PRECISIONLAP 900 utilizes precise motion control systems to ensure accurate and repeatable wafer grinding, lapping, and polishing. These motion control systems also allow for precise leveling of the machine's surface to ensure uniform surfaces across the wafer. 900 is lightweight, compact, and easily accommodated in a larger facility. With its sturdy, ergonomic design and enclosed working area, the machine is well suited for even tight environments. PRECISIONLAP 900 also features an integrated wafer handling tool that allows for rapid loading and unloading of wafers on the machine. The asset utilizes vacuum hold-down mechanisms to ensure a secure grip on the wafer during the grinding and polishing process. 900 is a powerful wafer grinding, lapping, and polishing model that offers users a superior level of process control and repeatability. With its integrated loading and handling equipment and precise motion control systems, PRECISIONLAP 900 provides a highly reliable and efficient platform for producing even and consistent surfaces across wafers.