Used PRESI MECAPOL P 400 #9182845 for sale

Name: PRESI MECAPOL P 400
Brand: PRESI
SKU: 9182845
Availability: InStock

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Wafer Grinding, Lapping & Polishing

Manufacturer

PRESI

Model

MECAPOL P 400

ID: 9182845

Polishing machine Bottom chuck: 400 mm Top chuck: 200 mm Base plate: 0.380 mm Almag plate: 0.400 mm x 20 mm Variable speed: 30 to 300 rpm Constant torque Progressive acceleration 2-Pre-selected speed: 50/100 rpm 2-Direction rotations Digital display of speeds Touch sensitive keys with LED indicators Frame protected against rust corrosion Painted steel body Large proportional bowl, tilted and removable Water inlet driven by sluice gate Multi spray water cooling Voltage: 230 V, 1 Phase Power: 750 Watts PE.RE B: Polishing head with central pressure Digital display of time and pressure Low pressure loading and unloading Touch sensitive keys Adjustable sweep (Position, amplitude and velocity) Tank for 150 ml of lubricant Adjustable and driven lubricant flow Consolidated spindle Variable speed: 20 to 80 rpm Pneumatic pressure: Electronically from 0,5 to 40 daN Direct reading of pressure Voltage: 230 V, Single phase Power: 120 Watts 2005-2006 vintage.

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PRESI MECAPOL P 400 is an advanced wafer grinding, lapping and polishing equipment. It is designed to achieve the highest quality levels for wafer processing requirements. The system consists of 6 independent workstations that can be configured for various grinding, lapping, and polishing operations. In addition, each station is designed with a patented and proven industrial-grade motor controller that help to provide consistent performance. The unit utilizes a sophisticated grinding, lapping and polishing process with a unique motor and variable speed control interface. This interface ensures accurate control of the motor speed and a consistent material removal rate. The patented workstation design also allows for precise mechanical adjustments and process optimization. MECAPOL P 400 is designed with a process parameter adjustment function, making it easier for operators to monitor and adjust the machine parameters in real time. It is also equipped with a high-precision computer-controlled tool, making it possible to achieve highest-quality processing results. The asset is equipped with an automatic wafer centering model, which ensures that the wafers are consistently centered and perfectly aligned for optimal processing. The grinding disc is equipped with a patented and proven flat diamond grinding disc, that ensures accurate grinding surfaces with minimal surface deformation. The wafer lapping station offers a fully automated lapping process, ensuring that each wafer receives the same lapping treatment. The equipment is also equipped with an intelligent feedback system which monitors and engages operations according to the given parameters. With the feedback unit, operators can easily adjust operating parameters and select the optimal process for their needs. In addition to its features, PRESI MECAPOL P 400 also offers a user-friendly control interface with a clear display and touch panel. This user-friendly interface offers clear instructions and operation guides, making it easy for operators to set up the machine and achieve the desired results. MECAPOL P 400 is an ideal choice for wafer grinding, lapping and polishing applications, providing excellent results and consistent performance. With its advanced features and user-friendly controls, it is a reliable tool for both engineering professionals and laboratory researchers looking for optimal wafer processing results.