Used QRT BESTPOL P260 #9267599 for sale

QRT BESTPOL P260 wafer grinding, lapping, and polishing equipment is a precision machine for the preparation of flat surfaces on wafers for semiconductors and optical components. It is suitable for a wide range of production and laboratory applications such as wafer thinning, polished subsurface profile planarization, edges precision, and surface smoothing. The P260 consists of a spindle drive, precision feed mechanism, process control unit, and a servo control system. Its spindle drive is capable of handling the high precision grinding movements required for wafer processing with sub-micron accuracy. This spindle drive also eliminates vibration and ensures a smooth grinding process with a low noise level. The precision feed mechanism features a dual axis design enabling the wafer to be processed in a repeatable pattern. This feed unit is adjustable to control the feed rate and wafer size, and is equipped with a built-in laser pointer for precise positioning. The process control unit uses an intuitive user interface and custom-made software to monitor process parameters and ensure consistent results from one batch of wafers to the next. The servo control machine is designed to monitor and regulate the movement of the spindle drive for precise wafer grinding, lapping, and polishing operations. This tool allows the operator to adjust the speed and direction of the spindle as well as the amount of material removed during the process. Additionally, the servo asset monitors air pressure and water temperature to eliminate contamination and keep temperatures stable for a consistent wafer surface finish. Overall, BESTPOL P260 is a robust and reliable model designed to provide superior performance for wafer grinding, lapping, and polishing operations. This equipment can accurately process wafers of various sizes and is equipped with user friendly controls and powerful servo mechanisms for precise operation and reliable results.