Used QRT BESTPOL P262 #9267531 for sale

QRT BESTPOL P262 is a single-side abrasive wafer grinding, lapping and polishing equipment. It is designed for high-precision, single-side polishing of silicon wafers up to 4" (102mm) in diameter. It is ideal for applications such as grinding, lapping, and polishing of flat surfaces and can be used for many different types of materials. The system utilizes a computer-controlled, brush-controlled spindle, which allows for precise wafer grinding, lapping and polishing. The spindle has adjustable speeds ranging from 80 to 600rpm, making it suitable for a wide range of applications. Additionally, the unit allows for automated control of the force, velocity and direction of the abrasive media. It can also be used to polish small areas of the wafer with greater precision. The P262 offers several features to improve the quality and accuracy of the process. The design includes a dynamically balanced grinding wheel which gently mobilizes the wafer's surface without introducing excessive vibration and heat. It also includes a vacuum hold-down which improves the stability and alignment of the wafer during processing. Furthermore, a specially designed turret allows for quick and easy loading and unloading of different abrasive media. BESTPOL P262 is configured with a wide variety of options. These include a choice of grinding techniques, various abrasive media, and software for controlling the various parameters of the process. The machine is designed to be as accurate and efficient as possible and is equipped with a range of safety features such as automatic shut-off in case of emergency, and audio and visual alarms. Overall, QRT BESTPOL P262 is a reliable and precise wafer grinding, lapping and polishing tool. Its various features, along with its accurate and efficient computer-controlled design, make it an ideal solution for a variety of applications. It offers consistent results and delivers superior performance, making it an excellent choice for high-precision wafer processing.