Used R&D ARW-8C1A #9165239 for sale

R&D ARW-8C1A is a state-of-the-art wafer grinding, lapping & polishing equipment designed to meet the demanding requirements of the modern microelectronics industry. ARW-8C1A uses advanced technology to provide precise, repeatable results quickly and consistently. The system uses an up-and-down grinding motion combined with a rotational movement to flatten and polish the wafer surface. This process is known as "precision grinding" and ensures that the desired shape and surface accuracy are achieved. The unit is equipped with an automatic wafer loading/unloading machine and a continuous grinding process control tool. It also features a flexible and easy-to-use computer-controlled interface. In addition to its efficient wafer grinding capabilities, the asset can also perform lapping and polishing operations. The lapping process uses high-precision diamond tools to achieve superior surface finishes. The polishing process removes any surface defects and produces a smooth, mirror-like finish. Both lapping and polishing processes can be conducted on either wet or dry materials. The model is designed for ease of operation and is able to maintain high production throughput with minimal user input. It is also highly customizable, allowing users to adjust various parameters such as rotation speed and pressure while the equipment is running. This ensures that each part is handled with the utmost care and precision. R&D ARW-8C1A is an incredibly versatile system that can be used to process a variety of materials including silicon wafers, ceramic discs, and glass. It is ideal for those looking to increase their production efficiency and maintain high-quality standards. The unit is also capable of handling a variety of wafer sizes and shapes.