Used R&D ZAB-8W2M #9165240 for sale

R&D ZAB-8W2M wafer grinding, lapping and polishing equipment is designed to meet the needs of advanced semiconductor device fabrication. This innovative system incorporates an advanced design that provides superior throughput, excellent surface finish, and reliable, repeatable results. The unit is designed to handle a variety of wafer sizes ranging from 2" to 8" in diameter with a maximum thickness of 30mm. The feed rack is capable of automatically handling up to 40 wafers with a maximum weight capacity of 1.5kg. Up to three lapping and polishing operations can occur simultaneously while keeping the processing parameters consistent. Automated diagnostics monitor the process and alert operators of any problem areas to ensure optimal process control. ZAB-8W2M utilizes a sophisticated grinding, lapping and polishing machine that incorporates a high precision linear motor stages and an advanced control module. This grinding tool is capable of efficiently grinding down samples to a thickness as small 10 µm with a roughness of less than 0.01µm. The lapping asset, consisting of a lap wheel and conditional abrasive, ensures excellent repeatability and control over the process parameters while providing excellent surface finish. The polishing model ensures an excellent surface finish by using a combination of media and a slurry tank to clean and remove any residue from the surface. R&D ZAB-8W2M's advanced design uses process monitoring parameters combined with the advanced linear motor controls to deliver optimal process control. Fault detection and auto-correction capabilities reduce the risk of process errors. Advanced features such as the automated cleaning of process chambers minimize wasted time and effort on maintenance and sanitation. ZAB-8W2M equipment is equipped with a user-friendly HMI that makes setting up and monitoring the process control parameters straight forward. Additionally, optional extras such as process monitoring and API can provide data for further process analysis. In conclusion, R&D ZAB-8W2M is a reliable and repeatable grinding, lapping and polishing system that offers advanced process control, superior throughput and excellent surface finish.