Used RETRONIX 4520 #293616013 for sale

RETRONIX 4520 is designed specifically for the high-volume production of wafers. It is a fully integrated, multi-tasking wafer grinding, lapping and polishing equipment - essential for precision wafer edge grinding, surface lapping and chemical-mechanical polishing. This equipment is capable of thinning and uniformly lapping highly automated processes for standard wafers of all sizes, both round and rectangular. At the core of 4520 Wafer Grinding, Lapping & Polishing System are its powerful 5-axis robotic arm and customizable motion control technology. It enables consistent high-throughput production with superior results, such as superior surface finishes and reduced cycle times. RETRONIX 4520 accommodates a wide range of wafer diameters and thicknesses, as well as shaped wafers for high-volume production runs. The grinding process utilizes custom-designed diamond wheels to effectively reduce feature heights, while a dedicated lapping chamber is designed to accurately (to 4 μm) lap the substrates. The polishing stage employs specialized pillow-pad mechanical polishing pads combined with slurry and abrasives. The resultant high surface quality and uniformity allows for a wide range of applications. 4520 is equipped with a thermal grind unit that enables temperature control of the grinding and lapping stages to improve pattern fidelity and reduce edge rounding. This combined with its chemical-mechanical polishing machine improves wafer flatness and the repeatability of critical features. This makes it an invaluable asset to wafer manufacturers - saving costs, improving yields, and shortening time to market. RETRONIX 4520 offers full process integration with a Windows-based user interface. This powerful package allows users access to a vast array of parameters, making it fully customizable to the application. It also allows users to easily store and retrieve recipes, while an integrated recipe editor enables fast and easy recipe modification. Overall, 4520 is an essential addition to wafer production operations, offering a highly automated, repeatable and accurate grinding, lapping and polishing process - enabling uniform, smooth surfaces and high surface quality to be achieved across all production runs.