Used REVASUM 6EC-II #293601512 for sale

REVASUM 6EC-II is a precision wafer grinding, lapping and polishing system designed to enable customers to quickly, precisely, and cost-effectively process the most complex semiconductor and compound materials. It is the industry leader in grinding, lapping, and polishing of 300mm and 200mm diameter semiconductor wafers and other substrates. 6EC-II precision wafer grinder utilizes a dynamic array of parallel grinding wheels, including a servo-driven front grinding wheel, to produce surfaces with superior finish and uniformity. REVASUM 6EC-II uses a series of rotating platen disks to achieve both grinding and lapping operations. By controlling the relative speed and pitch of the grinding disks, 6EC-II can precise adjust the size and shape of the grits each operation uses to obtain optimal material removal. REVASUM 6EC-II is also capable of parallel polishing of wafers using precision polishing cloths and abrasive media. 6EC-II uses advanced image mapping techniques to ensure that wafers are uniformly ground and lapped, with maximum uptime between wheel/pad changes. REVASUM 6EC-II also offers advanced process control capabilities via simple software adjustments. This enables users to accurately adjust process parameters and control the overall process output. 6EC-II is fully automated, from initial run-in and setup procedures, to monitoring and recording post-process results. In addition, REVASUM 6EC-II is equipped with a wide range of safety features, including pressure sensors, interlocks and redundant automated alarms. 6EC-II's open architecture design allows for easy integration and compatibility with various automated process systems. Overall, REVASUM 6EC-II wafer grinding, lapping and polishing system provides customers with cost-effective and reliable processing, enabling them to quickly achieve repeatable processing performance with maximum uptime. Thanks to its flexible and advanced design, 6EC-II is the ideal system for a range of applications, from semiconductor and compound materials to flat substrates.