Used ROBERT HAGEMANN Class 100 #293662487 for sale

ROBERT HAGEMANN Class 100 wafer grinding, lapping & polishing equipment is designed for research and development applications in the semiconductor industry. This system combines precision polishing of silicon wafers for measurement accuracy and repeatability. It utilizes a direct-drive motor to drive the grinding/lapping/polishing plunger which facilitates precise wafer movements and grooming operations. The power source is a single-phase 230 VAC TO 120 VAC at 60Hz, making the unit suitable for both cleanroom and lab environments. The machine features a robust design constructed with high-quality materials and components. The exterior is built out of stainless steel for long-term use and protection. The top section contains precision-ground plates that enable wafer manipulation with millimeter accuracy. The operator's panel contains touch screen and LCD for real-time feedback on the precision process. The human-controlled user interface allows for inputting preferences pertaining to each of the three processes of the machine. Settings can be adjusted to suit different wafer types and to maintain depth objectives. It also features an internal console, where users can monitor a variety of parameters including pressure, temperature, speed, and abrasive size. The grinding process starts with a wet grind at low speeds and exposure to abrasives. This process removes defects and irregularities on the surface of the wafer. After, the wafer is moved and pressed onto the lapping platen. For lapping, abrasives are sprinkled onto the platen and the minor irregularities and micro-burrs created during the grinding process are eliminated. Finally, the polishing process eliminates the remaining lengthwise, crosswise, and in-and-out surface scratches through exposure to abrasives and air at high and consistent speeds. In the end, when the desired surface finish is achieved, the wafer is then carefully inspected and metrology data is recorded. Class 100 wafer grinding, lapping & polishing tool is equipped with all the necessary tools and technologies for users to achieve state-of-the-art fine finish on a silicon wafer for improved device performance. It is ideal for research and development units, series production, and collaborative projects in the semiconductor industry.