Used ROGERS AND CLARKE L-250-S #77437 for sale

ROGERS AND CLARKE L-250-S is a versatile and high-performance wafer grinding, lapping and polishing equipment. Specifically designed to offer a highly controlled, automated process for the lapping and grinding of thin-wafers, its advanced design ensures high precision and repeatability in addition to reduced maintenance costs and downtime. L-250-S system is composed of three major components: wafer grinding and lapping spindles, wafer polishing spindles, and the C-frame drive unit. The wafer grinding and lapping spindles house independent three-phase motors designed to grind and lap the edges of thin-wafer specimens with repeatable results. Its grinding process actively reduces specimen distortion, leaving the edges of the wafer with the desired dimensions and accurate surface finishes. The polishing spindles utilize soft friction counter blades to impart a consistent finish on the thin-wafer specimens. The C-frame drive machine provides for high accuracy in specimen positioning, allowing for exacting distance measurements as well as repeatable rotational indexing. Made of high-quality stainless steel, ROGERS AND CLARKE L-250-S tool is made to last. The wafer grinding and lapping spindles are capable of working with wafer sizes up to 250 mm in diameter and are specially optimized to minimally distort the specimens during the grinding process. The polishing spindles feature on-the-fly fine-tuning to ensure a uniform finish every time. The C-frame drive asset helps to ensure that delicate specimens are handled with extreme care, resulting in consistent specimen reorientation and position measurements. In addition to its unique performance characteristics, L-250-S model also offers ergonomic and cost-saving features. The equipment is designed with the user in mind, featuring optimized accessibility and workflow. Its ability to process large batches of thin-wafers in a single cycle cuts down substantially on time and energy costs. With their integrated design and automated processes, the system also reduces the need for manual labor and individual wafer handling. ROGERS AND CLARKE L-250-S is an innovative unit designed to offer maximum precision, repeatability, and productivity in thin-wafer grinding, lapping and polishing. Its intuitive design and automated processes make it a cost-effective and user-friendly solution for a wide range of thin-wafer processing applications.