Used ROGERS AND CLARKE L-250-S #99902 for sale

ROGERS AND CLARKE L-250-S
ID: 99902
Wafer Size: 10"
pel grinder, 10" 220 / 60 / 3 1/3 HP fixed speed oscillation motor 3/4 HP Eaton variable speed spindle drive.
ROGERS AND CLARKE L-250-S is a high-performance wafer grinding, lapping and polishing equipment developed to meet the conditions for low-cost, high-quality production. This system has been designed for use with compound semiconductor materials such as gallium arsenide (GaAs), indium phosphide (InP), and other semiconductor materials. L-250-S consists of a single cutting unit with a two-axis drive for wafer grinding, lapping and polishing. The unit features a grinding apparatus which is able to achieve a wide variety of machining capabilities, by featuring two kind of grinding wheels, high speed and low speed. The high-speed grinding wheel is capable of removing surface material at a rate of 150µm per minute, while the low-speed wheel can remove material at a rate of 20µm per minute. A fully adjustable lapping head provides passive smoothing and can be used to impart a low surface roughness on the wafers. Additionally, the machine can be used for polishing of the wafer to increase weak signal strength or precision. In this way, it can increase wafer yield and reduce yield discrepancies. ROGERS AND CLARKE L-250-S also offers an automatic wiring tool, which can be used to handle and process the wafers at high speed. The asset includes two control computers which can be used to control the grinding, lapping and polishing operations through either manual, semi-automatic and fully automatic modes. This wafer grinding, lapping and polishing model can achieve superior quality and faster throughput, as it is designed with a large-sized, highly efficient grinding unit and a high-precision lapping head. This equipment can be used for wafers of any size and is suitable for a variety of industries, such as precision optics, laser optics, monitor and display, microelectronics and semiconductor production. L-250-S is an ideal choice for those who require a high-quality, cost-effective and reliable wafer grinding, lapping, and polishing system. It offers unparalleled accuracy in the process, higher yield rates and the ability to deliver excellent product quality quickly, consistently and reliably.
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