Used ROLLOMATICS Machines #9004120 for sale

ROLLOMATICS Machines are a specialized line of wafer grinding, lapping, and polishing systems. This type of equipment is ideal for production operations due to its cost-effectiveness and high productivity. It's an automated grinding, lapping, and polishing system that can be used for wafer production and repair operations. Machines provide the user with a two-stage wafer grinding process, which includes lapping and polishing of the substrate material. The first stage is grinding, which helps to cut down the surface roughness. The machine features a powerful motor with adjustable speed control, enabling the user to adjust the grinding speed to achieve the desired output. In addition, the grinding tool is designed to reduce loading times and provide excellent protection to the wafer surface. The second stage is lapping and polishing. This involves feeding the material between two grinding discs attached to the lapping and polishing unit. A complete package solution is available, including an array of grinding discs, lapping blades and polishing pads. These components are designed to conform to the contours of the wafer substrate and provide a smooth finish. The grinding pressure can be adjusted to the material being used, giving the user flexibility to achieve the desired surface finish. ROLLOMATICS Machines provide a cost-efficient grinding, lapping, and polishing solution. The machine can process many different substrates, including optically transparent glass, semiconductor material, and dielectric materials. Machines offer automated grinding and polishing across multiple wafer thicknesses, enabling CPUs, memory chips, logic devices and DRAM, etc. to be processed without any manual intervention. ROLLOMATICS Machines also feature dust extraction and filtering systems. These systems eliminate the need for an operator and help to keep the workspace clean. The dust extraction tool is designed for quick and easy maintenance and ensures that the wafer grinding, lapping and polishing process is carried out in a safe, dust free environment. Machines have been proven to be reliable and easy to use. The wafer grinding, lapping and polishing solutions offered by these systems provide a cost-effective way for users to produce a range of products with excellent surface finish and accuracy.