Used ROYAL MASTER SA-449 #9085056 for sale

ROYAL MASTER SA-449 is an advanced wafer grinding, lapping and polishing equipment designed for critical applications in the semiconductor industry. The system offers superior accuracy and repeatability for surface finishing to high-end microelectronic substrate production standards. With its efficient, cost-effective and reliable operation, it is the ideal choice for optically flat and ultra-smooth surfaces in a variety of demanding materials and applications. The combination of a high-performance grinding wheel and an advanced servo drive unit provides SA-449 with exceptional grinding-lapping consistency and repeatability. With an integrated super-precision mechanical mounting machine, the wheel can be easily and precisely mounted in place. This ensures accurate placement within the grinding-lapping operations. The tool also features powerful grinding spindle speed control with precise rotational speed tuning for optimal performance. The integrated lapping asset leverages the consistent grinding performance of the wheel to produce ultra-flat and perfectly mirror-smooth surfaces. Powered by its unique oscillating plate motor with speed control, the lapping model is capable of synthetic diamond size dispersions and highly accurate surface finish levels with minimum waste and downtime. The robust movement of the motor also efficiently reduces particle burn. The removal of all scratches and defects on the internal edges of wafers is facilitated by the high-performance polishing equipment. The motor operated media allows a uniform finish with a combination of diamond and alumina solutions. The polishing system is specifically designed to reduce material costs and to minimize out of roundness and ovaling. ROYAL MASTER SA-449 includes user-friendly software for easy programming and testing of the grinding, lapping and polishing operations. With its intuitive graphical user interface, it possesses the capabilities to monitor and analyze machine performance and to adjust control parameters in real-time. Therefore, the unit allows for optimal adjustment of all parameters for superior surface finishes. This allows for automated and repeatable fabrication of high-end substrates with supra-sharp edges and optical flatness at extremely low rate of non-conformance. In summary, SA-449 is a cost-effective, efficient and reliable solution for wafer grinding, lapping and polishing. With its advanced design, superior accuracy and production efficiency, it is ideal for high-precision applications in the microelectronics industry.