Used RUSH 132C #9238645 for sale

RUSH 132C is a state of the art wafer grinding, lapping and polishing equipment designed to ensure the smooth, uniform finish of wafers used in the semiconductor and electronics industries. 132C is especially suitable for applications where the surface finish of individual wafers is critical. The system utilizes three grinding and polishing steps - rough grinding, fine grinding, and polishing - to achieve the desired result. The first stage of the unit is rough grinding, which is done using diamond abrasive tools that are held in place in the head of the grinder. This removes any high spots and produces the initial surface layer of the wafer. The second stage of grinding is fine grinding, which utilizes diamond embossed and impregnated grinding wheels to further refine the surface of the wafer. The last polishing stage employs a unique polishing machine which uses special abrasive pads and lubricants to produce an ultra-smooth surface on the wafer. RUSH 132C tool is fully automated, with advanced control features that allow the operator to adjust the speed and pressure as well as the direction of rotation. This ensures that the desired result can be achieved with greater consistency and accuracy. In addition, the grinding and polishing head is adjustable and allows the operator to move the head in any direction, allowing complete control over the process. 132C asset also contains advanced monitoring features, including temperature control and pressure monitoring systems which ensure that the grinding and polishing operations are done without overheating the wafer. This model also includes several safety features, such as emergency shut-downs and an overpressure shutdown equipment. These features ensure that the operator is always aware of the condition of the system and that the wafer remains in good condition throughout the process. Overall, RUSH 132C is an advanced and reliable wafer grinding, lapping and polishing unit that ensures the highest quality of wafer surfaces. This machine can be used for a variety of applications, ensuring that the surface finish of the wafer is of the highest possible quality. It has proven to be an invaluable tool for the semiconductor and electronics industries, and its advanced features ensure that it is a reliable and efficient tool.