Used SAGITTA ECP 2000 #9264986 for sale

SAGITTA ECP 2000 is a powerful precision wafer grinding, lapping & polishing equipment that can handle the toughest and most challenging grinds. It is the perfect solution for ultra-thin wafer device manufacturing that requires the highest level of accuracy & repeatability. SAGITTA ECP-2000 has the tools to enable unrestricted versatility. It is equipped with a unique "Contour Tooling" feature that allows for customized cutting profiles. This feature provides an economical, yet highly accurate, solution for a variety of tooling applications. ECP 2000 is capable of grinding, lapping, and polishing wafers from 12" to 200mm. It is also capable of grinding multiple faces of a wafer at once, allowing for faster production times and uniform repeatability. To optimize surface finish, ECP-2000 is equipped with a dual motor feed-system, enabling fast, controlled grinding pressure to the wafer. SAGITTA ECP 2000 has the ability to provide a great level of accuracy through a selection of measuring powers and process control systems such as "Nanometer Accuracy" and "Listening to Wafers". The Nanometer Accuracy unit allows for continuous monitoring and fine tuning of the wafer's surface, while Listening to Wafers empowers operators to further adjust the process based on precision audible feedback. SAGITTA ECP-2000 has an ergonomic design that allows for fast, safe, and easy operation. With an open frame layout, users can easily access the wafer to make quick, effortless changes. The design is completed with a 10-step fully automated operation process, giving the user a "set it and forget it" experience when running a lengthy batch of wafers. Overall, ECP 2000 is a high precision wafer grinding, lapping & polishing machine that is designed to provide ultra-high accuracy and quality results. With its versatile range of functions, innovative features, and precision control systems, ECP-2000 is the perfect tool for any precision wafer device manufacturing task.