Used SAGITTA ECP 2000 #9268862 for sale

SAGITTA ECP 2000 is a comprehensive wafer grinding, lapping, and polishing system. It is designed with a host of features and capabilities to meet the most stringent requirements for precision machining and precise polishing operations. SAGITTA ECP-2000 features a robust construction design composed of heavy-duty castings and rigidity to minimize overall deformation during production, with a well-balanced cutting head design that ensures accuracy throughout the entire process. It includes a customized grinding wheel diameter variation to maximize grinding and lapping efficiency. ECP 2000 puts forth an unbeatable production performance with superior up-time, accuracy, and repeatability and includes the latest electronics which enable easy machine operation. Built for flexibility, ECP-2000 offers 7 programmable x, y, and z axes and rotating work tables with the option of manual or CNC operation for grinding and polishing operations. The integrated feed-through feature allows for sophisticated part handling, as the grind head automatically follows the preset program from the single inlet port to the desired outlet port, promoting high-precision part control. SAGITTA ECP 2000 is outfitted with several advanced safety features that prevent workpiece collisions and accidents. The integrated AC direct drive motors enable superior characteristics, and the dedicated digital panel provides the user with a graphical, easy-to-understand user interface that vividly displays the parameters and settings. The machine can be operated in manual or automatic mode, allowing for relaxed operation. SAGITTA ECP-2000 is equipped with an extended grinding plate lifetime, outstanding cooling condition, excellent performance, excellent process stability, and an absolute minimal burr size for superior finishing. Its operation is also extremely energy-efficient and noise-free. This all-in-one wafer grinding, lapping, and polishing system is an invaluable tool for industry professionals who are looking for a reliable and time-saving method for improving precision results with ease. ECP 2000 is the ideal solution for all wafer grinding needs.