Used SAGITTA Gemini CX #9131726 for sale

SAGITTA Gemini CX is a high-performance wafer grinding, lapping, and polishing equipment. Gemini CX consists of a rotating grinding spindle that runs at high speed and a grinding disc that continuously oscillates in a range of up to 500 RPM or higher. The dynamic control of the grinding force at the exact point of contact of the grinding disc is adjustable to meet the specific requirements of the application, enabling precise leveling of very thin wafers. SAGITTA Gemini CX's high material removal rate is made possible through the use of advanced grinding and polishing abrasives, and a uniform grinding force allows for moreefficient and accurate grinding operations. The twin counter-rotating discs of Gemini CX enable striking wafer finishing and preparing thin-film structures with ultra-fine features. The system features advanced grinding and polishing fluids that are optimized to reduce the formation of particulate matter, generate minimal grinding heat and reduce workpiece distortion. The use of the efficient grinding and polishing fluids enables faster operation and reduces the need for frequent disc changes. SAGITTA Gemini CX's machine construction enables consistent grit size to be maintained during the grinding or polishing operations. This is made possible through the use of a two-stage grinding disc, which is designed to minimize the dust and contamination infiltration. Its overall machine structure also reduces vibration during the grinding operation, ensuring a smooth grinding surface and optimizing the spatial resolution. For automation, Gemini CX is equipped with an intelligent wafer handling unit. This machine allows the machine to recognize the position and orientation of each wafer relative to the spindle and grinding disc. In addition to the automatic loading and unloading of wafers, the tool also provides precise control and execution of the procedure parameters, such as grinding speed and pressure. Overall, SAGITTA Gemini CX is a high-performance wafer grinding, lapping and polishing asset. It provides high material removal rate and efficient grinding of ultra-fine structural features on thin-film wafers, due to its dynamic force control model, advanced grinding and polishing abrasives, efficient grinding and polishing fluids, two-stage grinding disc and intelligent wafer handling equipment. Gemini CX's unmatched precision in the grinding and polishing of wafers makes it an ideal solution for various industrial applications.