Used SAISA 102 #9308936 for sale

SAISA 102 is a wafer grinding, lapping and polishing equipment designed for precision operations and manufactured by SAISA, a leading provider of automated production systems for the semiconductor industry. Equipped with a fully featured grinding platform and intuitive user interface, 102 is capable of grinding wafers with two different grinding methods; alternate and deferred single-sided grinding processes. It is a high performance system designed to achieve sub-micron finish and guarantee high accuracy and repeatability on the ground surface of wafers. The unit's grinding mode allows a wide range of grinding operations, including grinding of both flat and curved surfaces as well as fine finishing. Moreover, the SISA SAISA 102 grinders are especially designed for use on large wafer substrates and their cutting edges are designed to protect from damage. The lapping process is also well-supported by 102 which offers precision and finishing operations essential to meet the demanding needs of high-precision applications. To optimize the lapping and polishing process, SAISA 102 is equipped with variable speed controllers and high resolution image systems to enable precise control of the grinding and polishing processes. In addition to the basic grinding, lapping and polishing functions, 102 machine offers various features, such as process recipes, customizable parameters for each grinding process, an integrated software program to record and analyze operating data, and easy to read reports. Efficient dust management is also a key feature of SAISA 102. The tool incorporates an efficient dust collection asset that captures and filters dust generated during the grinding and polishing processes. This helps maintain cleanliness in the working environment and reduces maintenance costs. The SISA 102 is an advanced, high performance model designed to meet the needs of demanding applications. Its sophisticated features and customizable process options make it the ideal choice for precision wafer grinding, lapping and polishing operations.