Used SAMSUNG C-4 3 #293669571 for sale

SAMSUNG C-4 3 Wafer Grinding, Lapping & Polishing Equipment is a fully automated system designed to deliver precision grinding, lapping, and polishing in one process. The unit features a double-sided faceplate spindle with three heads and a worktable for setting the grinding parameters. The operation is controlled by a multi-axis motion controller and incorporates a high-performance microprocessor for accurate control over parameters such as wheel speed, retraction speed, spindle speed and throw angle adjustments. C-4 3 is designed to meet the toughest demands of the semiconductor industry for tight precision tolerance and power efficiency. SAMSUNG C-4 3 features a main body that is built to withstand severe process requirements with a maximum rigidity structure, high-speed spindle, and heat dissipation machine. The grinding wheel carrier is constructed of high-grade stainless steel to guarantee accurate alignment and repeatable performance for long periods of time. The grinding heads for C-4 3 are made from durable high-density chromium plating and are specially engineered to minimize grinding pressure and maximize cutting performance. The faceplate spindle is of a double-sided design for increased productivity and rigidity, providing better-than-average cutting performance by maintaining an optimum grinding pressure distribution. SAMSUNG C-4 3 Wafer Grinding, Lapping & Polishing Tool features an optimal cooling asset for improved cutting performance and temperature claims for minimum degradation of the material's workability. The spindle is made by applying an air-suction-based cooling model to the spindle bearings, achieving full rotational speed with minimal thermal rise. The spindle operates with a maximum speed of 2,000 rpm. C-4 3 equipment is designed to meet a wide variety of workpiece materials and size capabilities with high-speed grinding and lapping motion that performs accurately through the entire process. The system also provides a digital controller that is programmed for fast and repeatable execution setting up an easy process with quality accuracy. SAMSUNG C-4 3 Wafer Grinding, Lapping & Polishing Unit is designed with the latest innovations in technology to integrate the entire cutting and finishing process in one automated machine for high productivity and accuracy.