Used SANBORN T22 HS-2-560 #9303069 for sale

SANBORN T22 HS-2-560 is a wafer grinding, lapping and polishing equipment which is designed to provide improved throughput, part accuracy and process control for the conditioning and smoothing of surfaces. It is suitable for flat panel substrates, discrete components, and shaped products. The system consists of rough grinding, rough lapping, fine lapping, polishing, profile lapping, and cleaning modules. The rough grinding wheel is an abrasive grit wheel, available in various grits, which is used to remove material at a rapid rate. The rough lapping process is used to provide an accurate surface profile. It is accomplished using fast to medium speed lapping with a diamond loaded grinding media. The fine lapping process is used to provide a superior finish on the substrate and is carried out by slow speed lapping with a monocleado slurry. The polishing module features a slurry cup which enables the substrate to be evenly plasticized during the process, resulting in a high quality and repeatable finish. The profile lapping module is designed to provide the highest accuracy on the finished product. It is accomplished using a diamond loaded slurry, which is rotated at a slower speed and with greater pressure than used for the previous lapping processes. Using this process, a range of precision surfaces can be created, from mirror-like flatness to complex contours. Finally, the unit includes a cleaning module designed for the removal of particles, residues, and lapping material. The machine utilizes an airflow tool, heat and chemical agents to effectively remove all unwanted material from the substrates. In conclusion, T22 HS-2-560 is a versatile and accurate wafer grinding, lapping and polishing asset which provides superior surface finishes for various substrates. It consists of five main modules; rough grinding, rough lapping, fine lapping, polishing and cleaning- providing increased throughput, part accuracy and process control.